Soft Solder Die Bonding

Besi specializes in the design and supply of fully automated soft solder die attach equipment for the power semiconductor mass market. With over 30 years of experience and a comprehensive portfolio of installed soft solder systems, Besi serves as a reliable partner for current and future power applications.

As power devices in communications, automotive, computing, home appliances, and handheld devices evolve towards miniaturization, there is an increasing demand for enhanced power dissipation in compact packages. This trend requires more stringent process control. Besi collaborates with key customers and leading material suppliers to develop optimal power packaging solutions. The patented Soft Solder Process Technologies offered by Besi enable customers to maintain a competitive advantage in the industry.