Discover how Besi is pioneering the future of semiconductor packaging. Join us at ECTC 2026 to learn about cutting-edge techniques that are set to revolutionize the industry.

Join Besi at the MiNaPAD conference 2026 in Grenoble, June 3 & 4. Don’t miss our presentation, "Sub micron placement accuracy – the era for heterogeneous integration and optoelectronic assemblies", showcasing cutting-edge advances in optoelectronic technology.

Join us at the heart of power electronics! Besi is excited to showcase its latest solutions and expertise at PCIM 2026. Visit us to discover how our innovative technologies are shaping the future of power electronics, intelligent motion, and energy management. Meet our experts, explore our products, and let's drive innovation together! Booth #6-430

Join us at the 3D & Systems Summit 2026 to explore the latest advancements and trends in heterogeneous systems. Engage with industry leaders, participate in insightful sessions, and network with peers. Don't miss out on this opportunity to shape the future of technology! Meet us at our booth.

Join us at SEMICON Taiwan 2026 at the Taipei Nangang Exhibition Center to discover the latest innovations in the semiconductor industry. Visit the Besi booth to learn how we are driving the future of semiconductor manufacturing. Don’t miss out on this premier event, mark your calendar today!