Esec 2100 hS iXplus
Introducing the Esec 2100 hS iXplus, the latest innovation in the renowned Esec Die Bonder 2100 i-Family. Engineered for speed, precision and long term scalability, this advanced system sets a new benchmark in die bonding technology while continuing the 2100 platform tradition of delivering the best total cost of ownership in its class.
Unmatched Speed, Quality and Stability
The new continuous epoxy pattern writing technology delivers significantly higher pattern application speed while ensuring greater stability in the dispense process. Combined with the UPH optimized Ultimate Dispense Vision strategy, the 2100 hS iXplus sets a new benchmark as the fastest and most stable single dispense die bonder on the market, delivering exceptional accuracy without compromise.
Additionally, the system integrates industry leading AI assisted vision inspection, enabling smarter, adaptive process control for consistently high quality, even with increasing material variation.
Seamless Synchronization
The dispenser’s remarkable ability to keep pace with the proven and further optimized pick & place mechanism ensures maximum throughput and outstanding process efficiency.
Highly Scalable on a Proven Platform
Built on the trusted and field proven 2100 i-platform, the 2100 hS iXplus offers unmatched scalability. A broad portfolio of options allows customers to adapt the system to evolving production requirements, ensuring future proof investment protection.
Furthermore, the platform’s industry leading tool to tool repeatability significantly reduces risk when scaling up production. Customers can expand capacity with confidence, knowing that process performance remains consistent across multiple tools.
Best-in-Class Cost of Ownership
Once again, Besi delivers a high performance die bonder that excels not only in speed and quality but also in providing best in class total cost of ownership (CoO).
Thanks to its proven platform stability, advanced vision capabilities, and exceptional process consistency, the 2100 hS iXplus helps customers achieve the highest yields, reduce operational costs, and benefit from outstanding long term reliability.
More information
Seeing is believing, so we are more than happy to give you a demonstration on a live system. Contact us today for more information.
Key Features
Fastest Single Dispensing System
- New continuous epoxy writing allowing high quality patterns at maximum writing speed
- Pattern integrated fast and reliable epoxy tailing prevention
- New ultimate fast vision process strategy
- Improved writing axes design
- The only Single Dispense System able to catch up with all P&P speeds
Optimized Pick & Place and Strip Transport
- Automatic Recipe optimization to maximize Bond UPH
- Enhanced Liquid Cooling System for even higher speed
- Speed optimized Pick & Place trajectory
- Intelligent speed optimized soft pick and bond modes
- Proven “light & rigid” P&P design
- Precision finished strip handler for most sensitive strips
- Reliable and save strip push out to magazine by clamp
Generation 5 Technology
- High performance 4-megapixel Vision System
- Up to three calibrated Dual Color Illuminations per camera
- Generation 5 Hardware Link (Gigabit Ethernet /GinLink)
- Latest high performance 8 core industrial PC
- State of the art User Interface including multiple camera inspection images and viewers
Scalable i-Family machine
The Esec 2100 hS iXplus can be scaled up or upgraded with 2100 i-machine family features, including:
- AI supported low contrast Epoxy Pattern detection
- Up looking Vision System
- High Precision Bond Head
- Pick Strip from Box capability
- Device Height Measurement System
- Epoxy Volume Measurement and Control
Specifications
Die Placement Accuracy Epoxy Process
- ≥2 mm: 12 μm / 0.2° (3σ) (in accuracy mode)
- ≥2 mm: 18 μm / 0.2° (3σ) (standard mode)
- ≥2 mm: 20 μm / 0.2° (3σ) (in high speed mode)
Productivity
- Up to 20,000 UPH
- MTBF: >200 h
Bond Process
- Bond force: 0.2 - 20 N
- Bond rotation: 360°
- Bond heating: programmable, max. 200°C
Substrate Dimensions
- Width: 23 - 102 mm
- Length: 90 - 300 mm
- Thickness: 0.1 - 2.5mm
Wafer and Die Dimensions
- Wafer size: 4” - 12”
- Frame size: 6” - 12”
- Die size: 0.5 - 20 mm
- Die thickness: > 0.075 mm
Machine Dimensions
- Footprint: W x D x H: 1,785 x 1,448 x 1,400mm
- Weight: approx. 1,400kg / 3,000 lb
Options
Substrate Handler
- Dual Input Handler (TOS with MHIN)
- Dual Input Handler for Pick Strip from Box (DINPU)
- Magazine Handler Input (MHIN only)
- Rail Downholder
- Pneumatic Downholder Disp/Bond
- Strip Marking Unit
- Strip Handler 100 mm cold Rail
- Precision Finished Strip Handler 100 mm hot taped QFN
- SMEMA Link Input
- SMEMA Link Output
Dispenser
- AI Epoxy Shape Check
- Dual Dispenser
- Dual Dispenser with Device Height Measurement
- Epoxy Volume Measurement (EVM)
Pick & Place
- Liquid Cooling System
- Up Looking Vision – Medium FoV
- Beam Die Sensor
- High Precision Bond Head
- Dual Stage Die Ejector
Vision (All Illumination systems with 2 colors)
- Dispense Indirect Illumination
- Dispense Vertical Indirect Illumination
- Disp. Vertical Indirect Illum. Polarized
- Bond Indirect Illumination
- Bond Vertical Indirect Illumination
- Bond Vertical Indirect Illum. Polarized
Automation
- Wafer Mapping including Conversion
- E142 Strip Mapping
- Transfer Logging
- Material Tracking
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer-Controlled Pick
- Ionizer-Controlled Bond
- Ionizer-Controlled Dispense
- Ionizer-Controlled Wafer Load Top
- Ionizer-Controlled Wafer Load Bottom
- Ionizer-Controlled Magazine Input
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
