Thermo Compression Bonding

Besi's Thermo Compression Bonding solutions deliver unparalleled precision and reliability for advanced packaging applications. Designed to meet the evolving demands of the semiconductor industry, our systems ensure optimal thermal and mechanical performance, making them ideal for high-density interconnects and next-generation devices. With a focus on innovation and efficiency, Besi's Thermo Compression Bonding technology empowers manufacturers to achieve superior yield and performance in their production processes.

9800 TC ^next

The 9800 TC ^next is the latest innovation in thermo compression bonding, designed to meet the evolving trends and stringent requirements of advanced packaging.

Datacon 8800 TC ^advanced

The Datacon 8800 TC ^advanced sets the new benchmark in Thermo Compression bonding with total process control, advanced capabilities and unsurpassed production stability.