For next generation silicon solar cells where the SiNx layer has been opened by laser ablation the Meco Direct Plating Line (DPL) can plate a dense layer of Ni-Ag, Ni-Cu-Ag or Ni-Cu-Sn onto high-ohmic emitters.

The Meco Panel Plating Line (PPL) electroplates a sub-micron layer of Copper, Indium and Gallium onto a glass substrate to form the absorber layers of a CIGS thin film solar cell.

The Meco CPL is based on the robust and proven concept of the Meco EPL which has built a reputation in the semiconductor world for leadframe plating applications.