The 9800 TC ^next is the latest innovation in thermo compression bonding, designed to meet the evolving trends and stringent requirements of advanced packaging.

With its revolutionary new pick and place concept, the Datacon 8800 FC QUANTUM ^hS sets the new benchmark in speed and productivity for mass reflow flip chip. 

The Datacon 8800 TC ^advanced sets the new benchmark in Thermo Compression bonding with total process control, advanced capabilities and unsurpassed production stability. 

The Datacon 8800 FC QUANTUM ^advanced - the undisputed market leader in mass reflow flip chip. 

The Datacon 8800 CHAMEO ^advanced is the pioneer multi-chip flip chip platform, enabling single pass production for higher accuracy and higher yield. 

Besi has integrated flip chip capability into the latest generation of the 2100 famliy - an agressive approach to driving down the cost of flip chip technology.