Multi Module Attach
Besi's advanced packaging system provides ultimate flexibility for die attach, multi-chip and flip chip applications.
Datacon 2200 evo
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Datacon 2200 evo plus
The Datacon 2200 evo plus is a die bonder for Multi Module Attach and assembles all kinds of technologies on a tried-and-tested platform.
Datacon 2200 evo hF
The all new Datacon 2200 evo hF is the ultimate multi-chip die bonding solution for high bonding force applications.
