Intelligence in Accuracy

• Device Height Sensor for extreme Z-Height Control
• High Precision Bond Head with highly accurate Theta-axis
• High accuracy closed loop P&P Z-axis
• High Resolution 4 Megapixel Vision Systems
• New High Resolution Up Looking Vision System
• High Accuracy Production Modes
      

Intelligence in Process Control

• Low Contrast Object detection vision capability
• Three Dual Color Light Sources per camera
• Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers
• Sensor status overview of vacuum, air pressure and temperatures.
      

Intelligence in Productivity

• Dual Dispensing Module with independent writing axes
• Dual 5 bar Pneumatic Dispense System Controller
• Superior and proven “light & rigid” P&P design
• High Performance P&P Y-axis with Liquid Cooling System
• High Performance 4th Generation Vision System
• High Speed Production Mode with excellent accuracy
      

Intelligence in Automation

• Automated Bond Head Tilt Adjustment
• Auto Adjusting Pick Up Tool and Capillary offsets
• Auto Adjusting Dispense Pressure after syringe change
• Constant dispensing with Dispense Volume Control
• Auto Position Adjustment of Die and Epoxy Placements
• Automatic Illumination Detection (vertical, indirect lights)
      

Die Placement Accuracy (DAF)

• >2 mm: 15 μm / 0.15° (3σ) (high speed mode)
• >2 mm: 10 μm / 0.15° (3σ) (accuracy mode)
• >2 mm: 8 μm / 0.12° (3σ) (up looking vision)
• MTBF: > 200 h
     

Die Placement Accuracy (Epoxy)

• >2 mm: 18 μm / 0.2° (3σ) (high speed mode)
• >2 mm: 12 μm / 0.2° (3σ) (accuracy mode)
• >2 mm: 10 μm / 0.15° (3σ) (up looking vision)
• MTBF: > 200 h
       

Bond Process

• Bond force: 0.2 - 50 N
• Bond rotation: 360°
• Pre-bond/bond/post-bond heating: programmable, max. 200°C
     

Substrate Dimensions

• Width: 15 - 125 mm
• Length: 90 - 300 mm
• Thickness: 0.1 - 2.5 mm 
     

Wafer and Die Dimensions

• Wafer size: 4” - 12”
• Frame size: 8” - 12”
• Die size: 0.5 - 20 mm
• Die thickness: > 0.075 mm
     

Machine Dimensions

• Footprint: W x D x H: 1785 x 1448 x 1400 mm
• Weight: approx. 1600 kg / 3500 lb
      

Substrate Handler

• Dual Input (MHIN and TOS)
• Magazine Handler Input (MHIN only)
• Raildownholder
• Motorized Downholder Disp/Bond
• Strip Marking Unit
• Strip Thickness Compensation
• Strip Handler 125 mm hot Flat with magnetic Y-Push-In
• Strip Handler 125 mm hot taped QFN
• Strip Handler 125 mm hot Stage-Z
• Substrate Blow-Off Kit
• Roll-Out Slippage Check
• Controlled Y-Axis Roll-Out
• SMEMA Link Input
• SMEMA Link Output
• Pick Strip from Box
     

Pick & Place 

• Massflow Die Sensor
• Liquid Cooling System
• Fusion Bonding
• Parallel Pick and Place 2
     

Die Ejector – Process Modules

• Ultra Thin Die Needle
• Ultra Thin Die Multidisc
• Ultra Thin Die Needle and Multidisc
• Dual Stage Die Ejector
      

Vision 

• Bond Height Measurement System (BHMS)
• Dual Dispense Indirect Illumination 2 colors
• Bond Indirect Illumination 2 colors
• Dispense Vertical Indirect Illumination 2 colors
• Bond Vertical Indirect Illumination 2 colors
• Uplooking Vision 
     

Automation 

• Wafer Mapping inclusive Conversion
• Host Communication Interface
• E142 Strip Mapping
     

Dispense

• Dual Dispenser System DHMS (DPDS-DHMS)
• Device Z-height Control (DZHC-i)
   

Miscellaneous 

• Uninterruptible Power Supply to PC
• Ionizer-Controlled Pick
• Ionizer-Controlled Bond
• Ionizer-Controlled Dispense
• Ionizer-Controlled WH Load Top
• Ionizer-Controlled WH Load Bottom
• Ionizer-Controlled Magazine Input
• Ionizer-Controlled Transfer Table
• Air Particle Sensor
• Clean Machine Environment Kit
• Strip Cleaning Unit
• Particle Removal Kit (Pick, Disp, Bond)