Highest Productivity

• High throughput up to 8,000 UPH
• Best-in-class process control
• High speed point-to-line pick & place
• High speed X-shuttle
  
  

Extended Application Range

• Wide range of SOT, TO and DPAK packages
• Single row and matrix leadframes
• Dual die capability
• Flying header / fullpack
• Leadframe conversioh kits
• Full range 8" wafer capability
  
  

Fastest Time to Yield

• Fast and easy setup
• Auto teach function
• Process visualisation
• Solder pattern technology
• Superior service & process support
  
  

Low Operating Costs

• Maximum reduction of material cost
• Lowest gas consumption

Fastest Soft Solder Die Bonder With a Wide Application Range

The ever more demanding market requirements lead to the evolution of the Esec Die Bonder 2009 fS^E, the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity. Furthermore, the Esec Die Bonder 2009 fS^E handles both, single row and matrix leadframes as well as a wide variety of applications like SOT-23, SOT-223, SOT-89, TO-92, TO-126, TO-220 or DPAK devices. The optional leadframe conversion kits offer an effective solution for future changes in the product mix.

Besi Switzerland, as the industry leader in soft solder die bonding, stands for excellent process technology and equipment performance at lowest cost of ownership.

The development of the Die Bonder 2009 fS^E is based on more than 30 years of experience. Once again we lead in terms of user-friendliness, productivity and process quality.

One typical example for lowest cost of ownership is the significantly lower gas consumption of up to 50 percent relative to competing systems, which means massive savings in operating costs every day.