Key features

Next Generation Control Platform

• New motion control - New hardware & software
• Enhanced trajectory control - Reduced latency times
• More computing power - Process variable tracing
      

7-Axis / 250N Bond Head

• 3 Actuators for positioning - X, Y, Theta
• 2 Axes for bond control - Z, W
• 2 Actuators for auto tilt setup - A, B
    

Advanced TC-CUF Yield Control

• Yield and down-time prevention caused by flux
• Trajectory controlled heating and cooling
• New thermal stress resistant tool holder - Tilt
• Accurate temperature calibration station
    

Optimized Tool Holder & Tool Hardware

• New tool holder design - Special improved electrical contact mechanism
• Fast maintenance
• New tool design - Improved heater temperature accuracy and optimized electrical contact material
     

Integrated Monitoring & Alarming

• Alarm window setup for any process variable
• Process variable monitoring against defined alarm window
• Escaping alarm window generates machine stop and alarm
• Monitoring results available via SECS/GEM
     

Temperature Calibration Station

• Enhanced tool to tool repeatability
• In-situ temperature check - 20 to 240 °C within ±1 °C
• Portable sensor - Move from machine to machine
    

Tool to Tool Repeatability

• Recipe portability
• Separation of machine and recipe parameters
• Auto calibration - Consistantly calibrated tools
• Portable alarm windows
    

Specifications

Performance

X/Y placement accuracy	± 2 µm @ 3 sigma
Accuracy self check	Single BMC kit
Output	up to 1,000 UPH
Number of bond heads	2
7-axis TC bond head	-4° - 4° rotation
Tool heating	up to 420 °C
Ramping speed	+ 200 °C/s (Heating) - 100 °C/s (Cooling)
Temperature uniformity	± 5 °C
Interface temperature monitoring	Integrated measurement
Bond force	3 - 250 N (full UPH)
Bond control	Force / Height / Both combined
Tool flatness	± 1 µm
Co-planarity	± 2 µm @ 10 mm
Co-planarity set-up	Automatic
Footprint	1,600 x 1,200 x 1,880mm (with dual monitor)
Uptime	> 95%

 

Substrate & Carriers

C2S - Strips	max. 260 x 125 mm
C2S - Boats/Carriers	max. 260 x 125 mm
C2W - Wafers	max. 12" (300 mm)
C2W - Loading	Manual / FOUP on request (option)
Substrate heating	max. 200 °C ± 2.5%

 

Components

Die size	2 - 16 mm
Die thickness	50µm - 3mm, thinner on request
Wafer size	8" - 12" (200 - 300 mm)
Frame size	9" - 15" (125 - 375 mm)

 

Multi-chip Capability

Teaching	Camera view
Multi-chip modes	Stacked die or Side-by-side
Wafer change	Automatic (up to 25 types per cassette)
Pick & Place tool change	Manual
Ejector tool change	Automatic (up to 3 sizes)
Bond profiles	Individual bond profiles per stack layer

 

Component Handling

Flip chip unit	Pick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head
Wafer pre-rotation	0° - 280°
Slide fluxer	Optional
Cassettes	1
Cassette size	up to 25 film frames per cassette

 

Substrate Handling

Substrate & carrier transport	Gripper based with vacuum cups
Wafer transport	Robot handling (from dual FOUP port on request)
I/O buffer	Flat belt system, inline (SMEMA) or stand-alone possible
I/O Elevator type	Programmable lift systems for one magazine
I/O Magazine size	Various (on request)

 

Tool system

Bond tools	Integrated heater / cooler and temperature sensor
Single chip ejector	For one configured ejector tool
Multi chip ejector	Automatic quick changing carousel system, max. 3 ejector tools

   

Vision system

Field of View	Wafer camera: 12 x 12 mm  Substrate camera: 2.0 x 1.6 mm Up-looking camera: 2.0 x 1.6 mm
Illumination	Programmable RGB lighting (4 different colors)
Image recognition methods	Circle search, edge search, bump search, feature matching, structure search, epoxy inspection, contour inspection, datamatrix recognition, ...

   

Computer and MMI system

Operating system	Linux
User interface (GUI)	User-friendly graphical user interface with pull-down menus
Monitor	2x 19" flat screen
Data storage	HDD, USB
Data transfer	FTP via TCP/IP network, SECS/GEM
Interface	SMEMA 1.2, SECS-II (GEM compliant)

 

Standard software

Features	Post -bond inspection, Z-positional bonding, Auto-calibration
Programming wizards	Step-by-step guided programming with graphical support for e.g. product, substrate, component, epoxy

Options

 

Flux Application

• Flux film thickness: Cavity plates from 5 μm – 200 μm
• Viscosity range: 2,800 cps – 110,000 cps
    

Hardware

• Open platform architecture for full customization
    

Software    

• Single component tracking
• Wafer mapping
• Barcode scanner
• Data matrix recognition
• Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142)
• Pseudo X-Ray
• Flip and P&P Tool Inspection
• Needle Hole Inspection
• Eject Tool Needle Inspection
• Eject Tool Cap Inspection
• Ejection System Live Cam
• SECS GEM Parameter Provider
• Wafermap Verification by Border Component
• Configure User Level
• Advanced Flux Imprint Check
• Chipping Inspection
• Auto Illumination
• Distributed Bonding
• Lot Management
• Complete bonding
• Custom Slow Travel speed /distance
• Measure component spacing
• Individual bond position offsets
• Fluxlevel detection
• Parameter provider