Datacon 8800 FC QUANTUM hS
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield.
- Versatile High Speed Flip Chip Bonder
- Unique Quattro Concept
- Accuracy ± 4μm @ 3σ
- UPH up to 16,000
A Datacon QUANTUM system for your product
Seeing is believing, so we are more than happy to give you a demonstration on a live system in the Datacon QUANTUM range of flip chip equipment. Contact us today for more information.
Key Features
Extra Speed +100% Improved CoO
- Innovative "Quattro" multi nozzle concept
- Synchronous process steps
- High resolution large FoV camera systems
- Cluster adjust capability for bonding position alignment
Accuracy
- Proven accuracy 4μm @ 3s
- Enhanced 26MP camera system
- Optimized movements with Real Cross Influence
- New Matrix BMC 2.0
Full Yield Control
- Full Process & Production Control
- Superior usability with enhanced Pseudo X-Ray
- Fast Post Bond Inspection
- Individual Eject - Flip - and P&P - Toolinspection
- Chipping - / Die Crack detection
Ease of Use
- Minimal tooling quantity - fast device change over
- No die transfer shuttle - no intermediate steps
- Simple recovery handling
- Auto nozzle offset correction
Specifications
| X/Y placement accuracy | ± 4µm @ 3sigma |
|---|---|
| Bond force | 0.5N - 5N |
| Die size | 1 - 14mm |
| Die thickness | 70µm - 2mm |
| Wafer size | 8" - 12" (on 8" or 12" wafer frames) |
| Substrate types | Singulated substrates in boats, strips, leadframe, wafer in carrier |
| Working range | 13" x 8" |
| Flux film thickness | Various cavity plates available |
| Size | 1,600mm x 1,200mm x 1,974mm (W x D x H) |
| Weight | 2,000kg |
| UPH | up to 16,000 (application dependant) |
| Vision system | 16 x 16mm FoV for substrate camera 29 x 29mm FoV for wafer and upwards camera |
