Datacon 8800 FC QUANTUM advX
Elevate Your Manufacturing Efficiency with the Datacon 8800 FC QUANTUM advX
Experience the next generation of Flip Chip assembly with the Datacon 8800 FC QUANTUM advX, our most advanced solution yet. Engineered to deliver extraordinary speed and precision, this state-of-the-art system is the perfect choice for high-volume production environments.
Supporting die sizes from 0.3 to 40 mm, the Datacon 8800 FC QUANTUM advX offers unmatched versatility to meet the full spectrum of mass reflow Chip-to-Substrate (C2S) applications.
With an outstanding placement accuracy of just 3 μm, it pushes the boundaries of what is possible in small bump mass reflow technology.
Superior Flip Chip Solution
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Up to 10k throughput
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0.3 - 40 mm chip size
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3 μm placement accuracy
Key Features
Unprecedented Speed
- Dual gantry system
- Super size CRYSTAL dipping
- Newest Besi vision technology
Full Yield Control
- Auto needle height determination
- Flip touchdown monitoring
- Flux depending dipping speed sets
Proven Production Accuracy
- 3μm at highest speed
- High resolution vision system
- Thermally optimized gantry system
Application Flexibility
- FC-BGA, FC-CSP, DRAM, Fan-out C2W
- Die size up to 40 mm
- Singulated substrates, strips and wafer
Specifications
| X/Y placement accuracy | ± 4µm @ 3sigma (± 3µm @ 3sigma option) |
|---|---|
| Bond force | 2 - 50N (0.5 - 10 N option) |
| Die size | 0.3 - 40mm |
| Die thickness | 50µm - 3mm |
| Wafer size | 4" - 12" (on 8" or 12" wafer frames) |
| Substrate types | Singulated substrates in boats, strips, leadframe, wafer in carrier |
| Working range | 13" x 8" |
| Flux film thickness | Various cavity plates available |
| Size | 1,600mm x 1,200mm x 1,791mm (W x D x H) |
| Weight | 2,100kg |
| UPH | up to 10,000 (application dependant) |
| Vision system | 12 x 12mm FoV for substrate camera 23 x 23mm FoV for upwards camera 13 x 13mm FoV for wafer camera |
Downloads
Datacon 8800 FC QUANTUM advX.pdf
PDF - 889 KB