Datacon 8800 CHAMEO advanced
Highest Productivity for FO-WLP
As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.
The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs.
Key Features
Multi-Chip – Combining Speed, Flexibility and Accuracy
- Multi-chip capability – Flexibility on smallest footprint
- Single pass is king – Improve your Cpk for multi-FC packages
- Waffle pack feeders – Extend your possibilities
- Extra Speed up to +40%
Enhanced Capabilities – Ready for the Future
- Thermo-compression – No limits for your applications
- Leadframe, strip, boat, wafer – No limits for your substrates
- Customized features – Exactly tailored for your process
- 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
- Face-down & Face-up (recipe controlled)
- Clean room class ISO 5
- Foup load port
- Tape & Reel
Highest Accuracy – Capturing Tomorrow’s Markets
- Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma – For fine-pitch and TSV applications
- Local reflow – Mastering sophisticated assemblies
- Long-term stability – Securing high yield at high speed
Wafer Level Applications
- Fan-Out Wafer Level Packages – Highest performance for lowest cost
- Advanced Chip to Wafer – Cost effective dual die stacking
- Through Silicon Vias (TSV) – Entry ticket to the future
Specifications
| Local accuracy | ± 3µm @ 3 sigma |
|---|---|
| Global accuracy | ± 5µm @ 3 sigma |
| Vision system | 4Mpix, 6 x 6mm FOV for substrate / upwards camera 12 x 12mm for wafer camera |
| Strips, Boats, Panels | 340mm |
| C2W | 12" |
| Fluxer | option, various cavity plates available |
| Multi Chip | included |
| UPH (dipping process) | 6,000 |
| UPH (FO-WLP / no dipping) | up to 9,000 |
| Clean room class | ISO 5 (optionally) |
| Capability integrity | enhanced standard |
| Local reflow | not available |
| Lead time | 8 - 10 weeks |
| Bond force | 0.5 - 50N |
| Die size | 0.3 - 30mm |
| Die thickness | 50µm - 3mm, thinner on request |
| Footprint | 1,600 x 1,200 x 1,880mm (W x D x H) (with dual monitor) |
Options
Substrate / Strip handling
- Input / output buffer
- Magazine loader / unloader ML1
- FOUP load port
- Pre-heat station
Vision system
- RGB lighting
- OCR recognition for substrates "Golden eye" upward looking camera
Software
- Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142)
- Pseudo X-Ray
- Flip and P&P Tool Inspection
- Needle Hole Inspection
- Eject Tool Needle Inspection
- Eject Tool Cap Inspection
- Ejection System Live Cam
- SECS GEM Parameter Provider
- Wafermap Verification by Border Component
- Configure User Level
- Advanced Flux Imprint Check
- Chipping Inspection
- Auto Illumination
- Distributed Bonding
- Single Component Tracking
- Lot Management
- Complete bonding
- Custom slow travel speed/distance
- Measure component spacing
- Measuring component bench
- Fluxlevel detection
- Individual bond position offsets
- Advanced base calibration
Component presentation
- Wafer stretcher (for 8" or 12" frames)
- Various stretch adapters (for metal and plastic frames)
- Wafer table rotation
Component handling system
- Input TS ionizer
- HEPA filter system class ISO5
- Pneumatic terminal
- Dipping station (slidefluxer)
- Face-up
- Tape & Reel
- Temperature (constant)
Others
- External vacuum pump
- Uninterruptable power supply
- ALPS Host computer
Downloads
Datacon 8800 CHAMEO advanced.pdf
PDF - 2 MB