Multi-Chip – Combining Speed, Flexibility and Accuracy

• Multi-chip capability – Flexibility on smallest footprint
• Single pass is king – Improve your Cpk for multi-FC packages
• Waffle pack feeders – Extend your possibilities
• Extra Speed up to +40%

Enhanced Capabilities – Ready for the Future

• Leadframe, strip, boat, wafer – No limits for your substrates
• Customized features – Exactly tailored for your process
• 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
• Face-down & Face-up (recipe controlled)
• Clean room class ISO 5
• Foup load port
• Tape & Reel

Highest Accuracy – Capturing Tomorrow’s Markets

• Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma – For fine-pitch and TSV applications
• Local reflow – Mastering sophisticated assemblies
• Long-term stability – Securing high yield at high speed
   

Wafer Level Applications

• Fan-Out Wafer Level Packages – Highest performance for lowest cost
• Advanced Chip to Wafer – Cost effective dual die stacking
• Through Silicon Vias (TSV) – Entry ticket to the future
   

X/Y placement accuracy local	± 3µm @ 3sigma (± 2µm @ 3sigma option)
X/Y placement accuracy global	± 5µm @ 3 sigma
Bond force	2 - 50N (0.5 - 10 N option)
Die size face down	0.3 - 30mm (40mm option)
Die size face up	2.5 - 25mm
Die thickness	50µm - 3mm
Wafer size	8" - 12" (on 8" or 12" wafer frames)
Strip, Boats, Panels	Up to 340mm
Substrate wafer	12"
Fluxer	option, various cavity plates available
Multi Chip	included
Tap feeder option	tape size 8 - 32mm
Clean room class	ISO5 (option)
Footprint	1,600mm x 1,200mm x 1,880mm (W x D x H)
Weight	2,000kg
UPH	Up to 6,000 (dipping process) Up to 9,000 (fan-out process)
Vision system	6 x 6mm FoV for substrate and upwards camera 12 x 12mm FoV for wafer camera