Multi-chip

• Fully automatic cycle for Multi-chip production
• Up to 7 Pick & Place tools (optionally 14), 5 eject tools
• Pressure/time (Musashi®), Auger, Jetter type dispensers available
• Epoxy stamping option
• Filled and unfilled epoxy, wide viscosity range
    

Accuracy

• New high-speed image processing unit
• Full alignment & Bad mark search
• Pre-defined fiducial geometry & customized teaching
    

Pick & Place Head

• Die Attach and Multi-Chip in one machine
• Die pick from: wafer, waffle pack, Gel-Pak®, feeder
• Die place to: substrate, boat, carrier, PCB, leadframe, wafer
• Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic

Performance

• X/Y placement accuracy: ± 7 µm @ 3s
• Theta placement accuracy: ± 0.10° @ 3s
• Bond Force: 0.5N to 75N programmable
   

UPH

• Die attach: up to 12,000 UPH/module
   

Bond Heads

• Standard bond head 0° - 360° rotation
• Heated bond head up to 450°C (optional)
   

Machine Dimensions

• LxDxH: 1,160 mm x 1,225 mm x 1,750 mm
• Weight: 1,300 kg
   

Statistics

• Uptime > 98 %
• Yield > 99.95 %
   

Wafer

• Die size Die Attach: 0.18 mm - 5 mm (hS mode)
• Die thickness: 0.05 - 2 mm
• Wafer size: 4" - 12" (SEMI M1)
• Frame size: FF070, FF105, FF108, FF123; automatic change (others on request)
   

Chip Trays

• Waffle pack / Gel-Pak® 2” x 2” and  4” x 4”
• JEDEC tray on request
   

Substrates and Carriers

• FR4, ceramic, BGA, flex, boat, lead frame, waffle pack
• Gel-Pak®, JEDEC tray, odd-shape substrates
• Substrate working range: 13” x 8” (325 mm x 200 mm)
   

Options

• Hardware: Open platform architecture for full customization
• Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more