Datacon 2200 evo hF
The all new Datacon 2200 evo hF is the ultimate multi-chip Die Bonder solution for high bonding force applications.
Flexibility
The Datacon 2200 evo hF is the most versatile machine for applications like Power Modules, IGBT, MCM and SiP. It is highly configurable with integrated dispenser, SEMI-conform 12" wafer handling, multiple pick- & place and eject tools, I/O systems and application specific options.
Accuracy & performance
The Datacon 2200 evo hF sets new benchmarks in its class, with an increased bond force of up to 500N and outstanding machine accuracy of ±10 µm @ 3s. The Datacon 2200 evo hF can be equipped with everything required for your application's successful mass production. The Datacon 2200 evo hF is ready for today's and tomorrow's processes and products.
Key Features
High force bonding
- Bond force 500 N
- Hot bond head
- Closed loop process control (force and temperature control)
Sintering
- Sinter film handling
- Sinter paste dispensing
- Pre-applied sinter paste
Heating
- 450°C tool
- 300°C substrate
Specifications
Performance
- X/Y placement accuracy: ±10 μm@3s
- Theta placement accuracy: ±0,15 °@3s
Bond Heads
- Standard bond head 0 ° - 360 ° rotation
- Heated bond head 450 °C (optional)
- Bond force: 0,5 N – 500 N
Footprint
- LxDxH: 1160 mm x 1225 mm x 1800 mm
Statistics
- Uptime > 98%
- Yield > 99.95%
Chip Trays
- Waffle pack/Gel-Pak® 2“ x 2“ and 4“ x 4“
- JEDEC tray on request
Substrates and Carriers
- Substrate working range
- 12“ x 7“ (300 mm x 175 mm)
- Substrate heating 350 °C (optional)
Wafer
- Die size die attach: 0,17 mm – 50 mm
- Die thickness: 0,17 mm – 7 mm
- Wafer size: 2“ – 12“ (50 mm – 300 mm)
