High Performance at High Accuracy

• Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
• High productivity, low cost-of-ownership
• Up to 4 working heads in one machine
   

Multi-Chip Capability

• Single pass production for complex products
• Die attach, flip chip, multi-chip in one machine
• Epoxy writing & stamping, flux dipping
   

Unbeaten Flexibility

• Die pick from wafer, waffle pack, gel pack, feeder
• Die place to carrier, boat, substrate, PCB, lead frame, wafer
• Hot and cold processes supported: epoxy, soldering, thermo-compression
• MCM, SiP, Hybrids
   

Open Platform Architecture for Full Customization

• Most advanced modular platform concept
• Production line tailored 100% to your needs
• Ideal solution with smallest footprint possible

Performance

• X/Y placement accuracy: ± 10 µm @ 3s
• Theta placement accuracy: ± 0.15° @ 3s
• Bond Force: 0.5N to 75N programmable
   

UPH

• Die attach: up to 7,000 UPH/module
• Flip Chip with dipping: up to 2,500 UPH/module
• Flip Chip without dipping: up to 3,200 UPH/module
   

Bond Heads

• Standard bond head 0° - 360° rotation
• Heated bond head up to 450°C (optional)
• UV Curing (365 nm & 405 nm)
   

Machine Dimensions

• LxDxH: 1,160 mm x 1,225 mm x 1,750 mm
• Weight: 1,300 kg
   

Statistics

• Uptime > 98 %
• Yield > 99.95 %
   

Wafer

• Die size Die Attach: 0.17 mm - 50 mm
• Die size Flip Chip: 0.5 mm - 50 mm
• Die thickness: >50 µm (thinner on request)
• Wafer size: 4" - 12" (SEMI M1)
• Frame size: FF070, FF105, FF108, FF123; automatic change (others on request)
   

Chip Trays

• Waffle pack / Gel-Pak® 2” x 2” and  4” x 4”
• JEDEC tray on request
   

Substrates and Carriers

• FR4, ceramic, BGA, flex, boat, lead frame, waffle pack
• Gel-Pak®, JEDEC tray, odd-shape substrates
• Substrate working range: 13” x 8” (325 mm x 200 mm)
   

Options

• Hardware: Open platform architecture for full customization
• Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more