9800 TC next
Next-gen die attach for chiplet & interposer packages
The 9800 TC next is the latest innovation in thermo compression bonding, designed to meet the evolving trends and stringent requirements of advanced packaging. Engineered for excellence, this system features significantly enhanced key performance indicators, ensuring superior results in every application.
Highlights of the 9800 TC next
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Advanced Micro-Inert Chamber
Optimized for minimal gas consumption, this critical assembly ensures efficient operation and cost savings. -
Unmatched Accuracy and Stability
Achieve precise bonding with long-term stability, perfect for advancing bump pitch scaling plans. -
Powerful Bonding Capabilities
The 9800 TC next delivers bonding forces up to 500 N, with an optional upgrade to 1 kN, accommodating a variety of bonding needs. -
High-Resolution Vision Systems
Ensures precise alignment and inspection, crucial for maintaining high quality standards. -
Thin Die Capability
Expertly handles thin dies, expanding your application possibilities. -
Superior Process Control
Advanced monitoring functions provide unparalleled control over the bonding process. -
Configurable Material Feeding System: Offers incredible flexibility, allowing for customized material handling to suit diverse requirements.
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Modular Design for R&D and High Volume: Available as a dual-module machine for high-volume production or as a single-module system tailored for R&D purposes. The system is upgradeable, adapting seamlessly to evolving use cases.
The 9800 TC next supports a wide range of applications, providing the versatility and performance you need to stay ahead in the rapidly evolving landscape of advanced packaging.
More information
Seeing is believing, so we are more than happy to give you a demonstration on a live system. Discover the future of thermo compression bonding now, with the 9800 TC next. Contact us today for more information.
Specifications
Material Handling
| Substrate wafer (through EFEM) | Up to 12” wafer from FOUP (3 x FOUP ports) & quarter panel (300 x 300 mm) |
| Substrate wafer thickness | 0.5 mm to 2.0 mm |
Component Supply
| Tray (Jedec) handling | Automatic Tray handling via FOUP |
| T&R cart (roadmap) | 8 mm up to 56 mm feeder |
| T&R cart capacity (roadmap) | Max. 60 x 8 mm feeder (30 pcs. per side) |
| Wafer handling (roadmap) | P&P from taped wafer, waffle pack, gel pack, etc. (up to 15" frames) via FOUP |
| Die transfer | Non flip & flip |
| Die size | 0.3 x 0.3 mm up to 70 x 70 mm** |
| Die thickness | < 25 µm up to 1.1 mm |
Thermal capabilities @35 mm heater size (70 mm heater size roadmap)**
| Substrate wafer temperature | 250°C ± 5°C @ 3s over 300 mm |
| Bond head temperature | 450°C (500°C roadmap) |
| Bond head heating rate | > 400°C/sec from 100°C to 400°C |
| Bond head cooling rate | > 75°C/sec from 350°C to 150°C |
| Bond head thermal control & uniformity | static thermal control: ± 1°C dynamic thermal variation: < 5°C static thermal uniformity: ± 2.5°C |
** heater sizes up to 100 x 100mm under feasibility review
P&P capability @35 mm heater size (70 mm heater size roadmap)**
| Accuracy X & Y [GoG @150°C] | 0.5 µm @3s |
| Accuracy theta [GoG @150°C] | 1 mdeg @3s |
| WCC (worst case corner) [GoG @150°C] | 0.8 µm @3s |
| Bond head Z control & accuracy | ± 1 µm @3s |
| Bond force | -15 N up to 500 N (1 kN on request) ± 5% of set force @3s (forces > 2 N) ± 5% of set force @3s (forces -15 N to -2 N) ± 0.1 N of set force @3s (forces -2 N to 2 N) |
| Tilt control | < 1 µm (< 2 µm for 70 mm heater size) |
| UPH (bond time 1 sec) | up to 2500 (product/process dependent) |
** heater sizes up to 100 x 100mm under feasibility review
Other
| Inert environment | N2 micro chamber (< 100 ppm O2 @ 75 l/min) / hot pick capability / flux exhaust (optional & on request) |
| Cleanroom class | ISO 5* / Class 100 (FS 209E) |
| Footprint | 6.08 m2 (configuration dependent) |
| Weight | Approx. 7.8 tons (configuration dependent) |
* to be proven in production environment
Software & Automation
- Bond traces and trace viewer
- Bin code matched bonding
- Easy machine calibration via SW assistants
- Inline process monitoring and control
- Main supply surveillance
- Easy product setup via SW assistants
- Parameter provider via SECS/GEM
- E142 map handling
- Full factory automation for Industry 4.0
