THESE MATERIALS ARE NOT DIRECTED AT OR ACCESSIBLE BY PERSONS LOCATED IN ANY JURISDICTION WHERE THE DISTRIBUTION OF THESE MATERIALS WOULD BREACH ANY APPLICABLE LAW OR REGULATION OR WOULD REQUIRE ANY REGISTRATION OR LICENSING WITHIN SUCH JURISDICTION.

Duiven, the Netherlands, July 8, 2024 - BE Semiconductor Industries N.V. (the “Company” or “Besi”) (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, announced today that it has received the corporate rating of Preliminary ‘BB+’; Outlook Stable from S&P Global Ratings and expects to receive the corporate rating of ‘BB+’ with a Stable Outlook from Fitch Ratings.

THESE MATERIALS ARE NOT DIRECTED AT OR ACCESSIBLE BY PERSONS LOCATED IN ANY JURISDICTION WHERE THE DISTRIBUTION OF THESE MATERIALS WOULD BREACH ANY APPLICABLE LAW OR REGULATION OR WOULD REQUIRE ANY REGISTRATION OR LICENSING WITHIN SUCH JURISDICTION.

Duiven, the Netherlands, May 9, 2024 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of an order for 26 hybrid bonding systems from a leading semiconductor logic manufacturer. The order is for Besi’s latest generation system incorporating 100 nm placement accuracy and is scheduled for delivery in Q4-24 and Q1-25. Besi anticipates receiving additional hybrid bonding orders from other customers in Q2-24 as well.

Duiven, the Netherlands, April 25, 2024 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced results of its Annual General Meeting of Shareholders (“AGM”).