BE Semiconductor Industries N.V. Announces Order for 26 Hybrid Bonding Systems

Duiven, the Netherlands, May 9, 2024 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of an order for 26 hybrid bonding systems from a leading semiconductor logic manufacturer. The order is for Besi’s latest generation system incorporating 100 nm placement accuracy and is scheduled for delivery in Q4-24 and Q1-25. Besi anticipates receiving additional hybrid bonding orders from other customers in Q2-24 as well.

Richard W. Blickman, President and Chief Executive Officer of Besi, commented: “The receipt of this significant order highlights the commitment by a second leading logic manufacturer to adopt hybrid bonding assembly technology for their most advanced data center applications. It also helps confirm the favorable long-term prospects and roadmap anticipated for Besi’s hybrid bonding systems in next generation AI related logic, memory and consumer related computing applications over the next decade.“

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BE Semiconductor Industries N.V. Announces Order for 26 Hybrid Bonding Systems

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