Duiven, the Netherlands, September 1, 2015 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of orders aggregating approximately USD 7 million for 8 thermo compression bonders (“TCB”) from a large North American semiconductor producer. The recent TCB order is part of a larger program for which Besi has received to date over 30 TCB orders for non-volatile memory applications.

Duiven, the Netherlands, July 23, 2015 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the second quarter and first six months ended June 30, 2015.

Duiven, the Netherlands, July 16, 2015 - BE Semiconductor Industries N.V. (“the Company” or "Besi") (Euronext: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, will release results for the second quarter ended June 30, 2015, on Thursday, July 23, 2015 at 7.00 a.m. CET (1.00 a.m. EST).

Duiven, the Netherlands, April 30, 2015 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (NYSE Euronext: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the declaration of a cash dividend for the fiscal year 2014.

Duiven, the Netherlands, April 30, 2015 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the first quarter ended March 31, 2015.