At SEMICON West 2025, taking place from October 7–9, 2025, at the Phoenix Convention Center in Phoenix, Arizona, Besi is excited to showcase our latest advancements in semiconductor assembly equipment. As the semiconductor industry continues to drive modern innovation, this premier microelectronics exhibition highlights Phoenix's emergence as a major tech hub.

Join Besi at SEMICON West 2025 to explore our cutting-edge technologies designed to meet the evolving demands of the semiconductor industry. Our comprehensive suite of equipment includes:

•     Die Attach Equipment: High-precision systems for various bonding applications.

•     Packaging Equipment: Advanced solutions for molding, trim & form, and singulation processes.

•     Plating & Cleaning Equipment: State-of-the-art systems ensuring optimal performance and reliability.

https://www.semiconwest.org

Stay tuned for updates on our booth number and presentation schedule. We look forward to connecting with you at SEMICON West 2025!