The semiconductor industry is evolving rapidly, driven by AI, smart devices, and advanced packaging innovations. At SEMICON China 2025, Besi will showcase its full suite of advanced semiconductor assembly equipment, designed to optimize efficiency, precision, and scalability in modern manufacturing.

Explore our industry-leading solutions, including:

• Die Attach Equipment – High-precision bonding for epoxy, flip chip, and soft solder applications.

• Packaging Equipment – Cutting-edge molding, trim & form, and singulation solutions for leadframe and wafer-level packaging.

• Plating & Cleaning Equipment – State-of-the-art continuous plating and leadframe cleaning for maximum performance and reliability.

Visit Booth N3645 to connect with our experts and discover the latest breakthroughs in semiconductor assembly!

https://www.semiconchina.org/

Shanghai, China | SEMICON China 2025 | Booth N3645