As microelectronics and advanced packaging continue to evolve, staying ahead requires cutting-edge solutions in heterogeneous integration, high-performance computing (HPC), AI, and next-gen interconnect technologies. At IMAPS 2025, Besi will present our latest innovations in die attach, packaging, and plating & cleaning equipment, designed to push the limits of precision, efficiency, and scalability.

Join us to explore:

• Advanced Package Structures – Solutions for heterogeneous integration, HPC, and AI applications.

• Next-Generation Interconnects – Innovations in bumping, wirebonding, and advanced interconnect technologies.

• Materials & Equipment – Enabling technologies that enhance reliability and performance in semiconductor packaging.

Visit our booth to discuss how Besi can help you tackle the next generation of packaging challenges!

https://imaps.org/page/IMAPS2025

San Diego, California, USA | September 29 - October 2 | Booth: TBD