We are excited to announce that Besi will be exhibiting at the European Microelectronics and Packaging Conference (EMPC 2025), taking place from September 16-18, 2025, in Grenoble, France. As a leading international conference for microelectronics packaging, EMPC 2025 is the perfect platform for us to showcase our latest solutions and expertise.

At Booth #37, our team of experts will be on hand to demonstrate how our innovative technologies are shaping the future of microelectronics packaging. We will be featuring our latest products and solutions, and we invite you to come and explore how they can help you drive innovation and success in your business.

EMPC 2025 is a unique event that brings together researchers, innovators, technologists, and business leaders from across the industry, providing a central platform for knowledge sharing, networking, and business opportunities. With its focus on industrial needs and trends, as well as academic long-term solutions, EMPC 2025 is an event not to be missed.

Grenoble, France | September 16-18, 2025 | Booth: #37

https://empc2025.org/

We look forward to seeing you in Grenoble!