At the 75th IEEE Electronic Components and Technology Conference (ECTC 2025), Besi is proud to present our latest research paper: Fluxless Thermocompression Bonding: Adapting to the Future

In this presentation, we will explore innovative approaches to fluxless thermocompression bonding, addressing the challenges and advancements in adapting this technology for future semiconductor applications. Our findings aim to enhance the efficiency, reliability, and scalability of bonding processes in advanced packaging.

https://www.ectc.net/

Grapevine, Texas USA | May 27–30, 2025